Variants
The 3M 5413 high temperature polyimide adhesive tape is designed for covering printed circuit boards during the soldering process and for other low and high temperature applications between -73 °C and 260 °C. This brown, 68.58 µm thick adhesive tape consists of a polyimide film with silicone adhesive. In addition, the roll core is made of polyethylene instead of cardboard. The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning and thus increasing productivity, and the polyimide adhesive tape is easy to remove from the surface as it does not soften at higher temperatures and retains its shape. This means that no post-processing, such as the removal of adhesive residues, is required. This adhesive tape can protect surfaces from the effects of chemicals and UV radiation. It is also flame retardant.
- The polyimide adhesive tape is easy to remove from the surface as it does not soften at higher temperatures and remains dimensionally stable. This means that no post-processing, such as the removal of adhesive residues, is required.
- This adhesive tape can protect surfaces from the effects of chemicals and UV radiation. It is also flame retardant.
- Roll core made of polyethylene instead of cardboard
- The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning.
- The high temperature resistance of the silicone adhesive reduces adhesive leakage, so there is no need for cleaning.
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