Variants
tesa HAF 8410 is a heat-activated film based on nitrile rubber and phenolic resin and is covered with a paper liner. The material is non-adhesive at room temperature and can therefore be easily cut and punched. The process temperature for pre-fixing is approx. 90°C. In a second processing step, the product is applied under heat and pressure.
- Adhesive film without carrier
- Carrier: without
- Adhesive: Nitrile rubber & phenolic resin
- Once fully cured, tesa HAF 8410 achieves extremely high bond strength as well as excellent temperature and chemical resistance. The adhesive joint remains elastic.
- 60µm reactive heat-activated film
- tesa HAF 8410 has been specially developed for implanting chip modules in smart cards and is also suitable for bonding temperature-resistant materials such as metal, glass, plastic, wood and textiles.
- The product is also suitable for bonding temperature-resistant materials such as metal, glass, plastic, wood and textiles.
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