Variants
3M High Temperature Polyimide Tape 5413 is designed for masking printed circuit boards during soldering and for other low and high temperature applications between -73 °C to 260 °C. This brown, 8.58 µm thick adhesive tape consists of a DuPont Kapton polyimide film with silicone adhesive. In addition, the roll core is made of polyethylene instead of cardboard. The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning and thus increasing productivity, and the polyimide adhesive tape is easy to remove from the surface as it does not soften at higher temperatures and retains its shape. This means that no post-processing, such as the removal of adhesive residues, is required. This adhesive tape can protect surfaces from the effects of chemicals and UV radiation. It is also flame retardant.
- The polyimide adhesive tape is easy to remove from the surface as it does not soften at higher temperatures and remains dimensionally stable. This means that no post-processing, such as the removal of adhesive residues, is required.
- This adhesive tape can protect surfaces from the effects of chemicals and UV radiation. It is also flame retardant.
- Roll core made of polyethylene instead of cardboard
- The high temperature resistance of the silicone adhesive reduces adhesive leakage, so there is no need for cleaning.
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